Testing inside the fab or packaging house can determine whether a chip or package meets all the functional requirements at time zero, but how that chip behaves in the field during its lifetime and under different workloads and environmental conditions may be very different. This is particularly true in AI data centers, where utilization of one or more dies may be significantly higher than in previous applications, thereby increasing the failure rate as latent defects turn into real defects and in-field conditions such as higher voltage, power, or temperature accelerate device aging. Nilanjan Mukherjee, vice president of engineering for the Tessent Division at Siemens EDA, talks about how, when, and where to design in-system tests, how monitoring data can be optimized for individual dies or fleets of devices in a data center, and how to use that data to proactively extend the life of systems.
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